Systems and methods for robotic arm sensing

ABSTRACT

In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm&#39;s interaction with a semiconductor processing chamber while the wafer is secured using the finger.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority to U.S. Provisional PatentApplication No. 62/585,752, filed on Nov. 14, 2017, which isincorporated by reference herein in its entirety.

BACKGROUND

Modern assembly line manufacturing processes are typically highlyautomated to manipulate materials and devices and create a finishedproduct. Quality control and maintenance processes often rely on humanskill, knowledge and expertise for inspection of the manufacturedproduct both during manufacture and as a finished product.

Typical assembly line processes for processing wafers (e.g.,semiconductor devices or materials) may employ no specific inspectiontechniques at a robotic arm aside from a manual inspection of roboticarm functionality. A robotic arm for semiconductor device processing maymanipulate (e.g., move) a wafer within the robotic arm's work envelope(e.g., a three-dimensional shape that defines the boundaries that therobotic arm can reach and manipulate a wafer). Performance of a typicalmanual inspection technique may take the robotic arm, and possibly theassembly line that the robotic arm is part of, offline. Such inspectiontechniques require large amounts of overhead and expensive hardware, butstill fail to produce satisfactory results. Therefore, conventionalinspection techniques are not entirely satisfactory.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that various features are not necessarily drawn to scale. In fact,the dimensions and geometries of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 is a block diagram of a gripper hand sensor on a robotic arm, inaccordance with some embodiments.

FIG. 2 is an illustration of a gripper hand sensor on a robotic arm, inaccordance with some embodiments.

FIG. 3 is a block diagram that illustrates a transfer module in which arobotic arm may function, in accordance with some embodiments.

FIG. 4 is a block diagram of various functional modules of a gripperhand sensor functional module, in accordance with some embodiment.

FIG. 5 is a flow chart of a gripper hand sensor process, in accordancewith some embodiments.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The following disclosure describes various exemplary embodiments forimplementing different features of the subject matter. Specific examplesof components and arrangements are described below to simplify thepresent disclosure. These are, of course, merely examples and are notintended to be limiting. For example, it will be understood that when anelement is referred to as being “connected to” or “coupled to” anotherelement, it may be directly connected to or coupled to the otherelement, or one or more intervening elements may be present.

In addition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The present disclosure provides various embodiments of gripper handsensing for a robotic arm during semiconductor device processing. Arobotic arm may be a programmable mechanical arm to grasp, hold, andmanipulate objects (e.g., payloads) such as a wafer. The links of arobotic arm may be connected by joints allowing either rotational motion(such as in an articulated robot) or translational (linear)displacement. The links of the robotic arm may form a kinematic chain.The terminus of the kinematic chain robotic arm may be a gripper hand.The gripper hand may be any type of effector used for grasping orholding an object, such as a wafer, by a robotic arm.

A sensor for the robotic arm may be configured to collect sensor datafrom around the gripper hand. For example, a sensor may be mounted on orin the gripper hand to collect sensor data from the perspective of thegripper hand. A robotic arm may execute an automated routine as part ofa semiconductor assembly line process. For example, the robotic arm maybe configured to execute an automated robotic arm routine to move wafersin an automated fashion to and from semiconductor processing chambers,load ports, or components of an automated material handling system.Accordingly, as the gripper hand is operated, sensor data may becollected from the perspective of the gripper hand to ascertain whetheran adverse condition is present so as to modify (e.g., stop) a roboticarm routine and/or perform remediation of a semiconductor assembly lineprocess. An adverse condition may be any condition for which it may bedesirable to stop or modify a robotic arm routine. For example, anadverse condition may be a prediction an imminent collision of a gripperhand with a surface, such as a wall of a semiconductor processingchamber. This adverse condition may be determined from sensor datacollected from around the gripper hand (e.g., gripper hand sensor data)that indicates that the gripper hand has moved to less than a minimumdistance to the surface. Accordingly, upon determination of an adversecondition based on gripper hand sensor data, an automated robotic armroutine that would otherwise have caused a collision of the gripper handto the wall of the chamber may be stopped and/or modified to avoid theadverse condition.

Furthermore, gripper hand sensors (e.g., sensors that collect sensordata from around the gripper hand) may assess an environment that thegripper hand interacts with over time by collecting sensor data fromeach iteration of an automated robotic arm routine. For example, thegripper hand sensor may collect temperature data on a semiconductordevice processing chamber that the gripper hand places wafers into orretrieves wafers from. As another example, the gripper hand sensor maycollect weight data from the various wafers that the gripper hand mayhandle. Accordingly, by analyzing the aggregated data from variousiterations of a robotic arm routine, an adverse condition may bedetermined based on detection of an outlier from the aggregated data. Incertain embodiments, these outliers may determine threshold values,which when passed, may define an adverse condition. These outliers maybe determined in accordance with conventional statistical analysis foroutliers. For example, these outliers may define threshold values for awafer that is too heavy or too light, which may be indicative of a waferthat is broken or improperly grasped or held. As another example, theseoutliers may define threshold values for a semiconductor processingchamber that is too hot or too cold (which may be indicative of asemiconductor processing chamber that may be malfunctioning).

FIG. 1 is a block diagram 100 of a gripper hand sensor 102 on a roboticarm 104, in accordance with some embodiments. As introduced above, therobotic arm 104 may be a programmable mechanical arm to grasp, hold, andmanipulate objects. The robotic arm 104 may include a base 106, at leastone link 108, and the gripper hand 110. The gripper hand 110 may be anytype of effector used for grasping or holding an object, such as awafer, by the robotic arm 104. The gripper hand may utilize any type ofgripping mechanism to manipulate an object, such as a wafer. Forexample, the gripping mechanism may be a pressure gripper (e.g.,gripping by applying pressure to an object, such as with a pincer typemotion), an envelope gripper (e.g., gripping by surrounding an object tobe manipulated), a vacuum gripper (e.g., gripping by suction force), anda magnetic gripper (e.g., gripping by use of electromagnetic forces). Incertain embodiments, the gripper hand may utilize at least two fingers,with one opposing the other. The multiple fingers may be utilized toapply pressure as a pressure gripper and or as an envelope gripper.

The base 106 may be a secured point at a terminus of the robotic arm.The base may be utilized to stabilize the robotic arm. For example, thebase 106 may be a part of the robotic arm that interacts with, andsecures the robotic arm relative to, a surface 112 on which the roboticarm rests. The surface 112 may be the ground or a platform on whichvarious semiconductor processing devices, such as semiconductor deviceprocessing chambers, may rest. In certain embodiments, the base 106 maybe secured via screws or other mechanical adhesives that adheres thebase to the surface 112.

The at least one link 108 of the robotic arm may be at least one piecethat connects the gripper hand 110 with the secured base 106. The atleast one link may be interconnected by joints 114 allowing eitherrotational motion (such as in an articulated robot) or translational(linear) displacement. Accordingly, the at least one link 108 of arobotic arm may form a kinematic chain with terminuses at the gripperhand 110 or the base 106. For example, the robotic arm 104 may include asingle link with two joints between the link and the gripper hand 110and the base 106 or may include multiple links (e.g., two links 108)with respective joints 114 between the links. The joints 114 may bepowered by a variety of means, including electric motors. The joints mayprovide the robotic arm with degrees of freedom, or an amount ofindependent motions in which the gripper hand may be moved.

A gripper hand sensor 102 may be a sensor mounted on, or within, thegripper hand 110. The gripper hand sensor 102 may collect sensor datafrom the perspective of the gripper hand 110. This sensor data may beutilized to characterize an environment that the gripper hand 110 isexposed to, such as the surroundings of the gripper hand 110, an objectgripped by the gripper hand 110 or a surface that touches the gripperhand 110. As will be discussed further below, this sensor data may beutilized in the performance of a gripper hand sensor process, which maydetermine whether an adverse condition is present. The gripper handsensor may be any type of sensor utilized to collect sensor data. Forexample, the gripper hand sensor may be at least one of a radar monitor(e.g., a frequency modulated continuous wave (FMCW) radar monitor), animage sensor (e.g., a CCD image sensor), a weight sensor (e.g., a weightsensor), an electronic nose sensor (e.g., a gas molecule detector), aninfrared range finder, and/or an infrared thermometer. In certainembodiments, it may be desirable to utilize gripper hand sensors thatare as small as practical, such as to not add unnecessary bulk to thegripper hand that may interfere with the operations of the gripper hand.

In various embodiments, different types of gripper hand sensors maycollect different types of sensor data for different uses. For example,a radar monitor sensor may collect frequency modulated continuous wave(FMCW) sensor data that can be utilized to determine a spatialrelationship, velocity, speed, or rate of movement as well as distancesto objects. An image sensor may collect image data that can be utilizedto characterize an image or a video of the surroundings of the gripperhand, for purposes such as to determine whether a semiconductorprocessing chamber has any abnormality. A weight sensor may collect realtime weight sensor data that characterizes a wafer weight, for purposessuch as to determine wafer chipping or breakages. An electronic nosesensor may collect gas molecule sensor data (e.g., the presence ofparticular gas molecules), for purposes such as to determine whetherthere are an abnormal concentrations of gas molecules around the gripperhand (e.g., within a semiconductor processing chamber). For example, theelectronic nose sensor may collect gas molecule sensor data to determinewhether wafer outgassing has occurred during semiconductor processing. Arange finder, such as an infrared range finder may collect infraredrange data on distances to a surface (e.g., distance form a gripper handto a surface of the chamber), for purposes such as to control robot armleveling. A thermometer, such as an infrared thermometer, may beutilized to determine the temperature at the gripper hand and/or withina chamber that the gripper hand may interact with.

In addition, various sensor tools that may facilitate the gathering ofsensor data may also be collocated, or proximal to the gripper handsensor. For example, a light source, such as a micro laser emittingdiode (LED) light, may be a sensor tool for an image sensor toilluminate an area from which sensor data is collected. Accordingly, thesensor tool may be configured to work in conjunction with the respectivesensor, such as a light source providing illumination (e.g., a flash)when the image sensor is collecting image data. As another example of asensor tool, a gas nozzle and/or a vacuum tip may be utilized tofacilitate detection of gas molecules by the electronic nose sensor. Forexample, the vacuum tip may be utilized to vacuum or bring gas moleculestoward the electronic noise sensor and the gas nozzle may be utilized toeject gas molecules away from the electronic nose sensor.

Although FIG. 1 illustrates a robotic arm 104 with only a single base106 and a single gripper hand 110, a robotic arm may have any number ofbases and/or gripper hands as desired for different applications inaccordance with various embodiments. For example, a robotic arm may havea single base and two or more gripper hands.

FIG. 2 is an illustration of a gripper hand sensor 202 on a robotic arm204, in accordance with some embodiments. The robotic arm 204 mayinclude a base 206, at least one link 208, and the gripper hand 210. Thebase 206, at least one link 208, and the gripper hand 210 may beinterconnected via respective joints 212. Furthermore, each of the links208 of the at least one link 208 may be also connected via respectivejoints 212. As noted above, the joints 212 may provide the robotic armwith degrees of freedom, or an amount of independent motions in whichthe gripper hand may be moved.

The gripper hand 210 may include at least two sets of opposed fingers214. The set of opposed fingers 214 may act as a pressure gripper in apincer type motion that slides into a wafer and then applies pressure tograsp the wafer so that the wafer is immobile while the gripper hand 210is in motion. Each set of opposed fingers 214 may be opened or closed bya gripper hand joint 216 between the two fingers 214, that facilitatesthe movement of the gripper's fingers 214.

The links 208 and associated joints 212 may be configured to provide arotational and/or lateral movement to the gripper hand 210. For example,each of the joints 212 may be configured to rotate and provide eitherrotation around an axis of rotation for the gripper hand 210 and/orlateral motion of the gripper hand such that the gripper hand 210 may bepart of reaching and retraction motions.

The gripper hand sensor 202 may be any type of sensor configured forcollection of sensor data as introduced above. It may be desirable forthe gripper hand sensor to occupy as small a footprint as practical onthe gripper hand 210 so as not to interfere with the operation of thegripper hand 210, or be damaged during operation of the gripper hand210. The gripper hand sensor 202 may be any type of sensor, such as atleast one of the sensors as discussed above. Although a single gripperhand sensor 202 is illustrated as being located on a finger 214 of a setof opposed fingers 214, gripper hand sensors 202 may be located in anylocation or in any number as desired for different applications inaccordance with various embodiments. For example, the gripper handsensor 202 may be embedded within the gripper hand 210 as opposed tobeing located on the gripper hand 210. Also, only one gripper handsensor 202 may be utilized for only one of the multiple sets of opposedfingers 214. Furthermore, multiple gripper hand sensors 202 may beplaced in a same place (e.g., as an integrated sensor with multiplesensor functionalities) or may be placed in different places (e.g., onopposite fingers 214 of a set of opposed fingers 214). Additionally, incertain embodiments, a gripper hand 210 may have an articulated fingerwhere parts of the articulated finger are connected by at least onegripper hand joint and a sensor is mounted on one of the parts of thearticulated finger or with a gripper hand joint.

FIG. 3 is a block diagram that illustrates a transfer module 302 inwhich a robotic arm 304 may function, in accordance with someembodiments. The transfer module 302 may include multiple semiconductorprocessing chambers 306, each configured to receive a wafer 308 forsemiconductor processing. Certain of the semiconductor processingchambers 306 may not include a wafer 308 while others may include awafer 308 at a point in time. The transfer module 302 may also include aload port 310 that interfaces with an automated material handling system312 that may bring wafers 308 into and out of the load port 310. Thetransfer module 302 may include the robotic arm 304 configured totransfer wafers among the semiconductor processing chambers 306 and theload port 310.

The chambers 306 may include any semiconductor processing chamber forreceipt and processing of a wafer or other semiconductor device. Exampleprocesses that may be performed in these semiconductor processingchambers include processes related to physical vapor deposition (PVD),chemical vapor deposition (CVD), chemical mechanical planarization(CMP), diffusion (DIF), wet etching, dry etching, photolithography,after developed inspection (ADI), after etched inspection (AEI),critical dimension (CD) inspection, scanning electron microscope (SEM)inspection, critical dimension scanning electron microscope (CD-SEM)inspection, wet cleaning, dry cleaning, and plasma etching.

FIG. 4 is a block diagram of various functional modules of a gripperhand sensor functional module 402, in accordance with some embodiment.The gripper hand sensor functional module 402 may be part of a roboticarm system that includes the robotic arm discussed above. The gripperhand sensor functional module 402 may include a processor 404. Infurther embodiments, the processor 404 may be implemented as one or moreprocessors.

The processor 404 may be operatively connected to a computer readablestorage module 406 (e.g., a memory and/or data store), a networkconnection module 408, a user interface module 410, a controller module412, and a sensor module 414. In some embodiments, the computer readablestorage module 406 may include gripper hand sensor process logic thatmay configure the processor 404 to perform the various processesdiscussed herein. The computer readable storage may also store data,such as sensor data collected by the sensors, data for identifying anadverse condition, identifiers for a wafer, identifiers for a roboticarm, identifiers for a gripper hand, identifiers for a sensor, and anyother parameter or information that may be utilized to perform thevarious processes discussed herein.

The network connection module 408 may facilitate a network connection ofthe robotic arm system with various devices and/or components of therobotic arm system that may communicate within or external to thegripper hand sensor functional module 402. In certain embodiments, thenetwork connection module 408 may facilitate a physical connection, suchas a line or a bus. In other embodiments, the network connection module408 may facilitate a wireless connection, such as over a wireless localarea network (WLAN) by using a transmitter, receiver, and/ortransceiver. For example, the network connection module 408 mayfacilitate a wireless or wired connection with various gripper handsensors, the processor 404 and the controller module 412.

The gripper hand sensor functional module 402 may also include the userinterface module 410. The user interface may include any type ofinterface for input and/or output to an operator of the robotic armsystem, including, but not limited to, a monitor, a laptop computer, atablet, or a mobile device, etc.

The gripper hand sensor functional module 402 may include a controllermodule 412. The controller module 412 may be configured to controlvarious physical apparatuses that control movement or functionality ofthe robotic arm and/or components of the robotic arm. For example, thecontroller module 412 may be configured to control movement orfunctionality for at least one of a link, the gripper hand, fingers, agripper hand sensor, a sensor tool and/or joints. For example, thecontroller module 412 may control a motor that may move at least one ofa joint, a finger, a gripper hand, a sensor, a sensor tool, and/or alink of a robotic arm. The controller may be controlled by the processorand may carry out the various aspects of the various processes discussedherein.

FIG. 5 is a flow chart of a gripper hand sensor process, in accordancewith some embodiments. The gripper hand sensor process may be performedby a robotic arm system, as discussed above. It is noted that theprocess 500 is merely an example, and is not intended to limit thepresent disclosure. Accordingly, it is understood that additionaloperations may be provided before, during, and after the process 500 ofFIG. 5, certain operations may be omitted, certain operations may beperformed concurrently with other operations, and that some otheroperations may only be briefly described herein.

At operation 502, a robotic arm routine may be initiated at the roboticarm system. The robotic arm routine may include any set of predeterminedset of operations for a robotic arm. For example, a robotic arm routingmay include iterations of picking a wafer up from a first location,moving the wafer to a second location, depositing the wafer at thesecond location for semiconductor processing (e.g., in a semiconductorprocessing chamber), retrieving the wafer from the second location aftersemiconductor processing, and returning the wafer to the first location(e.g., such as a load port or an automated material handling system sothat the wafer may be transported for further processing). Typically, arobotic arm may perform multiple iterations of the robotic arm routinein the performance of semiconductor processing. For example, the roboticarm of a robotic arm system may transfer multiple wafers betweendifferent locations at different times, where each wafer may betransferred in a same manner and among the same locations. Each of theselocations may be locations for which wafers may be located and/orprocessed in the course of semiconductor processing (e.g., as a stationof an assembly line). In certain embodiments, the robotic arm mayperform the processing, instead of being an instrument of transfer ofthe wafer between different chambers or stations for semiconductorprocessing.

At operation 502, sensor data may be collected at a gripper hand sensorof the robotic arm system. The collection of sensor data may occur inreal time as the robotic arm routine is being performed. This sensordata may be utilized for analysis of whether an adverse condition ispresent. In various embodiments, the sensor data may be stored locallyat the respective sensor that collected the sensor data and/or may bestored in the computer readable storage discussed above.

As introduced above, the gripper hand sensor may be any type of sensorutilized to collect sensor data. For example, a radar monitor sensor maycollect frequency modulated continuous wave (FMCW) sensor data that canbe utilized to determine a velocity, speed, or rate of movement as wellas distances to objects. An image sensor may collect image data that canbe utilized to characterize an image or a video of the surroundings ofthe gripper hand. A weight sensor may collect real time weight sensordata that characterizes a wafer weight. An electronic nose sensor maycollect gas molecule sensor data (e.g., the presence of particular gasmolecules). A range finder, such as an infrared range finder may collectinfrared range data on distances to a surface (e.g., distance form agripper hand to a surface of the chamber). A thermometer, such as aninfrared thermometer, may be utilized to determine the temperature atthe gripper hand.

In addition, various sensor tools that may facilitate the gathering ofsensor data may also be collocated, or proximal to a respective gripperhand sensor. For example, a light source, such as a micro laser emittingdiode (LED) light, may be a sensor tool for an image sensor toilluminate an area from which sensor data is collected. As anotherexample of a sensor tool, a gas nozzle and/or a vacuum tip may beutilized to facilitate detection of gas molecules by the electronic nosesensor. For example, the vacuum tip may be utilized to vacuum or bringgas molecules toward the electronic noise sensor and the gas nozzle maybe utilized to eject gas molecules away from the electronic nose sensor.

At operation 506, the sensor data may be analyzed by the robotic armsystem to determine whether an adverse condition has occurred.Specifically, the gripper hand sensor functional module may perform thisanalysis based upon the sensor data gathered by at least one gripperhand sensor. An adverse condition may be any condition for which it maybe desirable to stop or modify a robotic arm routine. For example, anadverse condition may be a prediction of an imminent collision of agripper hand with a surface, such as a wall of a chamber. This type ofadverse condition may be detected by utilizing a sensor such as a rangefinder or a radar monitor to determine a closeness or trajectory of agripper hand during the robotic arm routine and triggering an adversecondition when the distance of a gripper hand to a surface, such as awall of a semiconductor processing chamber, is below a threshold value(e.g., a minimum safe distance between a gripper hand (or a gripper handsensor) to the surface).

As another example of an adverse condition, sensor data from an imagesensor may be collected and analyzed to determine whether an adversecondition such as a fire or other abnormality is present from the imagesensor data. For example, the gripper hand sensor functional module mayanalyze the image sensor data for indicia of a fire via conventionalimage analysis techniques.

As yet another example of an adverse condition, sensor data from aweight sensor may collect real time weight sensor data thatcharacterizes a wafer weight to detect wafer chipping or breakages. Forexample, the gripper hand sensor functional module may monitor waferweight sensor data and detect an adverse condition when the wafer weightis below a minimum weight threshold (which may be indicative of achipped, broken, or incomplete wafer) or above a maximum weightthreshold (which may be indicative of a wafer with an undesirableartifact on it, such as another wafer or an artifact that inadvertentlyfell on the intended wafer for transport by the gripper hand).

As yet another example of an adverse condition, sensor data from anelectronic nose sensor may be analyzed to determine whether there is anundesirable presence of a particular molecule or molecular concentrationof a particular molecule. For example, an adverse condition may bedetermined if sensor data from an electronic nose sensor detects anabnormal concentration of a particular gas.

As yet another example of an adverse condition, sensor data from atemperature sensor may be analyzed to determine where there is anabnormal condition during semiconductor processing, such as overheatingor overcooling when an operational temperature detected by thetemperature sensor exceeds a threshold value or is under a thresholdvalue.

At operation 508, a robotic arm routine may be modified or adjusted bythe robotic arm system based on the detection of the adverse condition.Accordingly, as the gripper hand is moved, sensor data may be collectedfrom the perspective of the gripper hand to ascertain whether an adversecondition is present so as to compensate for the detected adversecondition. In certain embodiments, upon detection of a particularadverse condition, the robotic arm routine may pause and/or move to arestart position. For example, upon detection of a robotic arm routinethat detects an adverse condition (e.g., a distance of a gripper hand toa surface being below a threshold value), the robotic arm routine may bestopped and the robotic arm reset back (e.g., retracted) to an earlierposition to restart or continue the robotic arm routine.

In particular embodiments, the robotic arm routine may be stopped for anindefinite period of time pending remediation of the detected adversecondition without moving to an earlier position. For example, certaintypes of adverse conditions (e.g., a failure of the robotic arm or asemiconductor processing chamber) may not be resolvable from a reboot,or restarting the robotic arm routine.

In further embodiments, the robotic arm routine may be adjusted upondetection of a particular adverse condition by reconfiguring the roboticarm system to execute a different or a new robotic arm routine than therobotic arm routine being executed when the adverse condition wasdetected. For example, based upon detection of an adverse conditiondetected in a particular semiconductor processing chamber, the roboticarm system may restart or continue in execution of a different roboticarm routine that avoids the semiconductor processing chamber in whichthe adverse condition was detected.

Although particular adverse conditions, sensor data, and robotic armroutine adjustments are discussed above, other adverse conditions,sensor data, and robotic arm routine adjustments may be utilized in theperformance of a gripper hand sensor process as desired for differentapplications in accordance with various embodiments. For example, acombination of different sensor data may be collected and crossreferenced to determine the occurrence of an adverse condition.

In an embodiment, a robotic arm includes: a base; at least one linksecured to the base; a gripper secured to the at least one link,wherein: the gripper comprises a finger, the gripper is configured tosecure a wafer while the at least one link is in motion, and the gripperis configured to release the wafer while the at least one link isstopped, a sensor disposed on the finger, the sensor configured tocollect sensor data characterizing the robotic arm's interaction with asemiconductor processing chamber while the wafer is secured using thefinger.

In another embodiment, a system includes: a stabilization base; a linksecured to the stabilization base; a gripper hand secured to the link,wherein: the gripper hand is configured to secure a wafer while the linkis in motion, the gripper hand is configured to release the wafer whilethe link is stopped, and a sensor is disposed on the gripper hand.

In another embodiment, a method includes: collecting sensor data from asensor at a gripper hand, wherein: the sensor data characterizes arelationship between a semiconductor processing chamber and the gripperhand, and the gripper hand secures a wafer while the gripper hand is inmotion; detecting an adverse condition based on the sensor data; andcontrolling the gripper hand in response to detecting the adversecondition.

The foregoing outlines features of several embodiments so that thoseordinary skilled in the art may better understand the aspects of thepresent disclosure. Those skilled in the art should appreciate that theymay readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodimentsintroduced herein. Those skilled in the art should also realize thatsuch equivalent constructions do not depart from the spirit and scope ofthe present disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spiritand scope of the present disclosure.

Conditional language such as, among others, “can,” “could,” “might” or“may,” unless specifically stated otherwise, are otherwise understoodwithin the context as used in general to convey that certain embodimentsinclude, while other embodiments do not include, certain features,elements and/or steps. Thus, such conditional language is not generallyintended to imply that features, elements and/or steps are in any wayrequired for one or more embodiments or that one or more embodimentsnecessarily include logic for deciding, with or without user input orprompting, whether these features, elements and/or steps are included orare to be performed in any particular embodiment.

Additionally, persons of skill in the art would be enabled to configurefunctional entities to perform the operations described herein afterreading the present disclosure. The term “configured” as used hereinwith respect to a specified operation or function refers to a system,device, component, circuit, structure, machine, etc. that is physicallyor virtually constructed, programmed and/or arranged to perform thespecified operation or function.

Disjunctive language such as the phrase “at least one of X, Y, or Z,”unless specifically stated otherwise, is otherwise understood with thecontext as used in general to present that an item, term, etc., may beeither X, Y, or Z, or any combination thereof (e.g., X, Y, and/or Z).Thus, such disjunctive language is not generally intended to, and shouldnot, imply that certain embodiments require at least one of X, at leastone of Y, or at least one of Z to each be present.

It should be emphasized that many variations and modifications may bemade to the above-described embodiments, the elements of which are to beunderstood as being among other acceptable examples. All suchmodifications and variations are intended to be included herein withinthe scope of this disclosure and protected by the following claims.

What is claimed is:
 1. A robotic arm, comprising: a base; at least onelink secured to the base; a gripper secured to the at least one link,wherein: the gripper comprises a finger, the gripper is configured tosecure a wafer while the at least one link is in motion, and the gripperis configured to release the wafer while the at least one link isstopped; and a first sensor disposed on the finger, the first sensorconfigured to collect first sensor data characterizing a conditionwithin a semiconductor processing chamber while the wafer is securedusing the finger, wherein the first sensor comprises an electronic noseconfigured to measure a concentration of a gas molecule around thegripper.
 2. The robotic arm of claim 1, further comprising a secondsensor configured to collect second sensor data, wherein the secondsensor data indicates a weight of the wafer.
 3. The robotic arm of claim1, further comprising a second sensor configured to collect secondsensor data, wherein the second sensor data characterizes a spatialrelationship between the gripper and a surface of the semiconductorprocessing chamber.
 4. The robotic arm of claim 1, further comprising asecond sensor, wherein the second sensor is at least one of: a frequencymodulated continuous wave (FMCW) device, a charge coupled device (CCD),a weight sensor, an infrared range finder, and an infrared thermometer.5. The robotic arm of claim 1, the gripper is configured to reach withinthe semiconductor processing chamber.
 6. The robotic arm of claim 1,wherein the at least one link is configured to move the gripper betweenmultiple semiconductor processing chambers.
 7. A system, comprising: astabilization base; a link secured to the stabilization base; a gripperhand secured to the link, wherein: the gripper hand is configured tosecure a wafer while the link is in motion, the gripper hand isconfigured to release the wafer while the link is stopped; and a firstsensor is disposed on the gripper hand, wherein the first sensorcomprises an electronic nose configured to measure a concentration of agas molecule around the gripper.
 8. The system of claim 7, wherein thegripper hand comprises a set of fingers configured to secure the waferor to release the wafer.
 9. The system of claim 8, wherein the firstsensor is disposed on a finger of the set of fingers.
 10. The system ofclaim 9, the finger comprises articulated joints and the first sensor ispart of one of the articulated joints.
 11. The system of claim 8,wherein the first sensor is disposed on the gripper hand apart from theset of fingers.
 12. The system of claim 7, further comprising a secondsensor configured to collect data indicating a weight of the wafer. 13.The system of claim 7, further comprising a second sensor configured tocollect data indicating a spatial relationship between the gripper handand a semiconductor processing chamber surface.
 14. The system of claim7, further comprising a second sensor, wherein the second sensor is atleast one of: a frequency modulated continuous wave (FMCW) sensor, acharge coupled device (CCD), a weight sensor, an infrared range finder,and an infrared thermometer.
 15. A robotic arm, comprising: a base; atleast one link secured to the base; a gripper secured to the at leastone link, wherein: the gripper is configured to secure a wafer while theat least one link is in motion, and the gripper is configured to releasethe wafer while the at least one link is stopped; and a first sensordisposed on the gripper, the first sensor configured to collect firstsensor data that indicates a weight of the wafer.
 16. The robotic arm ofclaim 15, further comprising a second sensor configured to collectsecond sensor data that indicates a concentration of a gas moleculearound the gripper.
 17. The robotic arm of claim 15, further comprisinga second sensor configured to collect second sensor data thatcharacterizes a spatial relationship between the gripper and a surfaceof the semiconductor processing chamber.
 18. The robotic arm of claim15, further comprising a second sensor, wherein the second sensor is atleast one of: a frequency modulated continuous wave (FMCW) device, acharge coupled device (CCD), an electronic nose sensor, an infraredrange finder, and an infrared thermometer.
 19. The robotic arm of claim15, the gripper is configured to reach within the semiconductorprocessing chamber.
 20. The robotic arm of claim 15, wherein the atleast one link is configured to move the gripper between multiplesemiconductor processing chambers.